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Google’s Android mobile operating system will easily dominate the smartphone market by 2016, and it will be followed closely by Apple’s iOS.
Symbian captured about 36 percent market share in 2010 while Android was running on about 23 percent of all smartphones that shipped last year. Apple’s iOS held a solid 15 percent of the market share, while Research in Motion’s BlackBerry OS captured about 16 percent market share last year. Microsoft’s Windows Phone 7 share was mere 0.6 percent.  Android market share will continue to grow in the next five years. Prediction says that Android will be running on about 45 percent of all smart phones by 2015.
The estimation says that Apple’s market share will increase by 20 percent in 2015, while RIM will touch 14 percent share. It is assumed that Samsung’s Bada operating system could touch a 10 percent market share in 2015. It is also estimated that Microsoft’s Windows Phone 7 OS will have a market share of only 6.5 percent and Windows Mobile will witness even less than 0.5 percent of the mobile operating system market.

Among the Open-Source mobile platforms – MeeGo, Android and Symbian – Android is the clear winner. 500,000 new Android-powered phones and tablets are now being activated each day worldwide. This number is growing at 4% per week. In the last quarter, Apple sold about 19 million iPhones, for a daily activation rate of about 210,000. Including iPads and iPod touches in the survey, Apple’s activation rate was about 325,000.

Does this matter?

Mobile is becoming more like a platform game where the developers are building applications that run on top of mobile devices. These applications are making these devices more valuable to users – market share is a critical component. If Android holds a dominant market share, the way Microsoft’s windows did in the 1990s, Apple will get a setback & eventually iOS’s value as a platform will plunge.  Apple has learned several lessons from its failure in 1990s, one of the factor was competition in terms of price. iPhones and iPads cost the same or less than Android phones.

Apple still has an advantage that it didn’t have in the 1990s – Android is still a fragmented platform with so many different versions and customizations. Fragmentation of different versions of the Android Platform is still a problem for developers.

A smart move from Apple can be to work on the pricing model and plan to sell a ‘cheap’ iPhone to compete against Android threat.

NANOWIRE TECHNOLOGY

Posted by Ashka On April - 16 - 2011

NANOWIRE TECHNOLOGY

ASHKA JARIWALA

CHANDUBHAI S PATEL INSTITUTE OF TECHNOLOGY, CHANGA

  • ABSTRACT:

Nanowire technology is the key to the world of transparent and flexible electronics. Nanowire technology primarily consists of nanometer diameter wires synthesized onto plastic substrates to create electronic devices which are both transparent i.e. technology for next generation of optoelectronic devices which employs wide band-gap semiconductors for the realization of invisible circuits and flexible. This means it’s possible to for example, display information on windshields or windows of cars, or use outer wall surfaces of buildings as solar cells or even design devices flexible enough to bend in any direction. This paper gives a brief discussion of the nanowire structure, synthesis and discusses the possibilities as well as real time applications of nanowire technology to devices like TFT( thin film transistors), Organic LED’s, TRRAM( transparent resistive RAM), and a recent SNAP(superlattice nanowire pattern transfer) technology.

  • KEYWORDS:

Nanowires, Synthesis and structure, SNAP, TFT, OLED, TRRAM

  • INTRODUCTION:

Nanowires are cylindrical, triangular or trapezoidal shaped (depending on synthesis process) solid structures/wires having diameter of the order of nanometers (10-9m) and having infinite/unconstrained length. It is also referred to as 1-Dimensional since its length to diameter ratio is more than 1000:1. Depending upon their source material, they can behave as an insulator, semiconductor or a conductor. Metal oxides chosen as a synthesizing material decides the behaviour of nanowires. Quantum mechanical properties are very important in case of nanowires and the main principle of nanowire technology is quantum tunnelling. Quantum/electron tunnelling is a phenomenon in quantum mechanics where a particle tunnels through a barrier that it classically could not surmount because its total kinetic energy is lower than the potential energy of the barrier. Quantum tunnelling is a consequence of the wave-particle duality of matter and is often explained using the Heisenberg uncertainty principle. Nanowires have many interesting properties that are not seen in bulk or 3-D materials. This is because electrons in nanowires are quantum confined laterally and thus occupy energy levels that are different from the traditional continuum of energy levels or bands found in bulk materials. Examples of nanowires include inorganic molecular nanowires (Mo6S9-xIx, Li2Mo6Se6), which can have a diameter of 0.9 nm be hundreds of micrometers long. Other important examples are based on semiconductors such as InP, Si, GaN, etc., dielectrics (e.g. SiO2, TiO2), or metals (e.g. Ni, Pt).

  • SYNTHESIS:

Nanowires are not found naturally and must be synthesized/fabricated. There are two basic approaches of synthesizing nanowires: top-down and bottom-up approach.

Top down approach seeks to create nanoscale devices by using larger, externally controlled ones to direct their assembly. It uses traditional workshop or micro fabrication methods where externally controlled tools are used to cut, mill and shape materials into desired shape and order. This technique includes nanolithography via an electron beam and a relatively recent method known as Molecular Beam Epitaxy (MBE).

Molecular Beam Epitaxy:

Molecular beam Epitaxy takes place in high vacuum or ultra high vacuum (10−8 Pa). The most important aspect of MBE is the slow deposition rate (typically less than 1000 nm per hour), which allows the films to grow epitaxially. In solid-source MBE, ultra-pure elements such as gallium and arsenic are heated in separate quasi-Knudsen effusion cells until they begin to slowly sublimate. The gaseous elements then condense on the wafer, where they may react with each other. During operation, reflection high energy electron diffraction (RHEED) is often used for monitoring the growth of the crystal layers. A computer controls shutters in front of each furnace, allowing precise control of the thickness of each layer, down to a single layer of atoms. Intricate structures of layers of different materials may be fabricated this way. Such control has allowed the development of structures where the electrons can be confined in space, giving quantum wells or even quantum dots.

Nanolithography is the branch of nanotechnology concerned with the study and application of fabricating nanometer-scale structures, meaning patterns with at least one lateral dimension between the size of an individual atom and approximately 100 nm. Nanolithography is used during the fabrication of leading-edge semiconductor integrated circuits (nanocircuitry) or nanoelectromechanical systems (NEMS).

Bottom up approach using nanocrystals:

Bottom up approach seek smaller components built into more complex assemblies. They also use chemical molecules to cause single molecule components to: (a) self organize or self assemble into useful conformation (b) rely on positional assembly. The self assembly technique using nanocrystals will be explained below. The main example of bottom up approach is VLS or vapor-liquid-solid process. Other examples are vapor deposition, electrochemical deposition, pressure injection etc.

VLS Method:

The vapor-liquid-solid method (VLS) is a mechanism for the growth of one-dimensional structures, such as nanowires, from chemical vapor deposition. Growth of a crystal through direct adsorption of a gas phase on to a solid surface is generally very slow. The VLS mechanism circumvents this by introducing a catalytic liquid alloy phase which can rapidly adsorb a vapor to supersaturation levels, and from which crystal growth can subsequently occur from nucleated seeds at the liquid-solid interface. The physical characteristics of nanowires grown in this manner depend, in a controllable way, upon the size and physical properties of the liquid alloy. The VLS mechanism is typically described in three stages:

  • Preparation of a liquid alloy droplet upon the substrate from which a wire is to be grown
  • Introduction of the substance to be grown as a vapor, which adsorbs on to the liquid surface, and diffuses in to the droplet
  • Supersaturation and nucleation at the liquid/solid interface leading to axial crystal growth

STRUCTURE:

Transmission electron microscopy (TEM) is often used to examine the

crystallinity and structural morphology of Nanowires. Nanowires are primarily classified into 3 types of structures:

  • Crystalline- Nanowires are made with structured alignments of polymer chains.
  • Polycrystalline- Nanowires are made with repeating chemical units for molecule
  • Amorphous- Nanowires are made with random alignment of polymer chains.

Conductivity and working of nanowires:

The conductivity of a nanowire is expected to be much less than that of the corresponding bulk/substrate. Also the nanowires exhibit different mechanical, electrical and magnetic properties than the bulk/substrate due to their nanometer scale diameter like increased surface area, very high density of electronic states and joint density of quantum energy states. The conductivity of nanowires mainly depends on diameter as well as a phenomenon called ‘edge effect’ which also depends on the size of the diameter. If the diameter of the nanowire decreases, conductivity proportionally decreases since the free electrons do not get enough channel area for conduction. The edge effects come from atoms that lay at the nanowire surface and are not fully bonded to neighboring atoms like the atoms within the bulk of the nanowire. The unbonded atoms are often a source of defects within the nanowire, and may cause the nanowire to conduct electricity more poorly than the bulk material. As a nanowire shrinks in size, the surface atoms become more numerous compared to the atoms within the nanowire, and edge effects become more important.

Another interesting property is that some nanowires are ballistic conductors. In normal conductors, electrons collide with the atoms in the conductor material. This slows down the electrons as they travel and creates heat as a byproduct. In ballistic conductors, the electrons can travel through the conductor without collisions. Nanowires could conduct electricity efficiently without the byproduct of intense heat.

Techniques for mass production of nanowires haven’t yet been invented. However, if we use nanocrystals as a material for nanowire synthesis, this is possible. Once the nanowires are synthesized by any of the above methods, using the self assembly method, they are, at low temperatures integrated/etched upon the plastic substrate. The main advantage of nanowires here is that it is possible to etch them on plastic substrate at low temperature unlike other inorganic materials which require etching at high temperatures which resulted in damage/imperfections in the substrate. This technique physically separates the synthesis of the transparent nanomaterials from the subsequent transfer onto the substrate, which occurs under mild condition such as room temperature. As a result, the harsh conditions associated with the material synthesis, such as high temperatures, are separated from the device fabrication. Nanocrystals separate each layer of oxides like SnO2, SiO2, and finally an electrode layer of ITO. This technique ensures high uniformity and fabrication over large areas.

SNAP(superlattice nanowire pattern transfer):

This technique is based on translating vertical thickness control in thin-film growth into lateral spatial patterns. First, molecular beam epitaxy is used to grow a GaAs/AlGaAs superlattice consisting of alternating layers of GaAs and AlGaAs. Then the AlGaAs layers are selectively etched away to a depth of roughly 20-30 nm, tilting the superlattice and evaporated metal onto its end. Metal is only deposited onto the GaAs layers, since the sample tilt meant that the etched AlGaAs layers were not accessible. To transfer the resulting wires to a substrate, the metal-coated superlattice is placed face down onto a 10 nm thick epoxy film on top of a silicon wafer. The epoxy layer is cured using a heat treatment, “gluing” the wires to the substrate, and then the layer of GaAs oxide between the nanowires and the GaAs layers is etched away to free the wires from the superlattice

Its applications in electronics include novel demultiplexing architectures; large-scale, ultrahigh-density memory circuits and complementary symmetry nanowire logic circuits.

  • APPLICATIONS:

Nanowires have immense potential applications in the electronics industry. As different materials in the form of nanowire have different new properties, thus opening up many new applications, the potential applications of nanowires is therefore unlimited. Some of the important potential applications include:

  • · manufacturing TFT’s
  • · Organic LED’s
  • · TRRAM
  • · Vapor and Temperature Sensors for accuracy and atomic precision
  • · As photon ballistic waveguides as interconnects in quantum     dot/quantum effect well photon logic arrays
  • · Photovoltaic solar cells
  • · Flexible electronic devices using nanowire arrays integrated into plastic substrates
  • · As interconnect wires in field-effect transistors, resonators, nanomagnets, and spintronic systems
  • · Nanoelectrochemical systems (NEMS)

We will discuss the applications of nanowires in following applications in detail:

  • TFT (Thin film transistors) :

TFT ‘s or Thin Film Transistors have many applications in displays, printed electronics like Display screens, RFID’s( Radio Frequency Identification Tag) etc. However, when it comes to transparent and flexible applications, because of low electron mobility within the material, speed of operation is reduced. TFT’s designed using nanowires demonstrate considerably higher speeds TFT’s designed with nanowires demonstrate high electron mobility because of quantum tunnelling and because of near lack of imperfections in their crystalline structure which means less electron scattering.

Nanowire based TFT’s use mostly metal oxides like ZnO, In2O3, and SnO2 rather than Si because of advantages such as optical transparency, high mobility, and mechanical flexibility. Due to proper utilization of wide band gaps (<3 eV) of these metal oxides, nanowire TFT’s can be optically transparent. Also, nanowires synthesized using metal oxides allow higher density since larger area can be covered during fabrication.

  • Nanowire TFT:

In this case, the fabrication process consists of synthesizing the nanowires under optimized conditions (usually high temperatures), followed by transferto the substrate in a separate step, using solution- or dry-based transfer/alignment methods to complete device fabrication at low temperatures. Fig. shows nanowire based TFT’s consisting of single nanowire and multi nanowire network. Nanowire Network films can be deposited on the substrate/gate/dielectric by spin-coating, dropcasting, and thermal transfer. The TFT structure is completed by physical vapor deposition or printing of the source/drain contacts. The field effect mobilities in these TFTs can be extracted by conventional equations used for amorphous silicon.

  • Organic LED’s:

OLED’s or Organic LED’s are a very recent technology used primarily in display devices. Compared with well-established liquid crystal displays (LCDs) and plasma screens, displays based on organic LED’s offer more brilliant images with high levels of contrast. Typically, OLED’s emit their light through the glass substrate which comprises an electrode of a transparent conducting oxide (TCO), e.g. indium tin oxide (ITO). The top electrode (typically the cathode) is usually an opaque low-work-function metal layer. For a transparent OLED, the top electrode needs to be see-through as well.

Nanowire based OLED’s have the main advantage of being used in active matrix OLED displays. An active-matrix display is able to precisely direct the flow of electricity to produce video because each picture element, or pixel, possesses its own control circuitry.

OLED’s are now used in cell phones and MP3 displays and prototype television sets, but their production requires a complex process, and it is difficult to manufacture OLED’s that are small enough for high-resolution displays. Nanowire based OLED’s offer a solution here. Nanowire fabrication method is scalable, providing a low-cost way to produce high-resolution displays for many applications. Unlike conventional CMOS computer chips, the nanowire thin-film transistors could be produced less expensively under low temperatures, making them ideal to incorporate into flexible plastics that would melt under high-temperature processing. Nanowire TFT’s can be used in Active Matrix OLED displays as active switching and driving transistors as they increase aperture radio efficiency and decrease power consumption.

The main disadvantage of using nanowire TFT’s in OLED’s is the cost factor as cost of OLED’s becomes double that of LCD screens due to usage of ITO as indium is a rare element.

  • TRRAM (Transparent Resistive RAM):

TRRAM or Transparent Resistive RAM is the world’s first transparent computer chip similar to existing CMOS chips but with the difference that it is totally transparent. This technology has been developed by the Korean scientists and is non volatile in nature. It allows a device to store digital information in the same way as a memory card. By integrating TRRAM with other electronic devices like OLEDs, we can create totally transparent embedded systems and displays.

TRRAM’s could turn the concepts like Nokia ‘Morph’ into reality through see-through computer chips. And this is possible through the use of nanowires alongside TRRAMs. Though TRRAM is rigid in initial stages, it can be made flexible with the use of nanowire technology. Nanowires synthesized onto plastic substrate using bottom-up approach at low temperature result offer great flexibility since plastic is rugged, flexible, light and of course, transparent. This makes flexible electronic devices possible which when integrated with devices like TRRAM, can create devices both transparent and flexible.

The main possible applications of TRRAMs can be in transparent computer chips, concept mobile phones like nokia’s morph. Also, it is possible to manufacture TRRAM’s without using rare and expensive metals like iridium which would lower the cost considerably.

  • CONCLUSION:
  •  After analyzing the nanowire technology and its feasible applications, it can be concluded that nanowire technology is indeed the answer to many of the practical difficulties faced in designing transparent and flexible electronics and transforming them from science fiction to reality. Nanowire technology has immense applications and great future potential in nanoscale applications and devices and since last decade there has been continuous research on this technology for finding its potential in various applications. The major drawbacks it seems of this technology is the scarcity and cost of the elements used in the nanowire manufacturing and synthesis which results in increased cost of devices utilizing nanowire technology and the fact that no reliable technique has been developed to this date for mass production of nanowires and it remains confined to laboratory scale production.

     

  • REFERENCES:

[1] Antonio Facchetti and Tobin J Marks, Transparent Electronics – Synthesis and Applications

[2] www.wikipedia.org

[3] www.nanowerk.com

[4] www.azom.com

[5] www.engadget.com

[6] www.physicsforum.com

[7] www.library.thinkquest.org

[8] www.tms.org

[9] Nanoelectronics- Nanowires, Molecular electronics and Nanodevices-   Krzysztof Iniewski

Case Studies | PPTs

Posted by Vasanth Kamal On July - 30 - 2010
1.JetAnywhere print solution
1

Sub:-JetAnywhere print solution

By:-Ajay Patel

2.Symbion Health Ltd
1

Sub:-Symbion Health Ltd

By:-Saumya Suhagiya

3.Birnbaum Interpreting Services-Video remote Interpreting (BIS VRI).
1

Sub:-Birnbaum Interpreting Services-Video remote Interpreting (BIS VRI).

By:-hema singh

4.IPCL
3

Sub:-IPCL

By:-Tilak Patel

5.DEUTSCHE BANK  MARKET  RISK MANAGEMENT
4

Sub:-DEUTSCHE BANK  MARKET  RISK
MANAGEMENT

By:-Sneha Shah.

6.Vodafone Egypt#13;
5

Sub:-Vodafone Egypt

By:-Patel Mitesh

7.THE TIMES GROUP
6

Sub:-THE TIMES GROUP

By:-Ketan Patel

8.MAHINDRA & MAHINDRA
8

Sub:-MAHINDRA & MAHINDRA

By:-JIGNESH  RAVAL

9.TATA Consultancy Services (TCS)
9

Sub:-TATA Consultancy Services (TCS)

By:-Nimesh

10.Big C Super-center Public Co. Ltd.
j

Sub:-Big C Super-center Public Co. Ltd.

By:-Ajay Patel .L

10.Microsoft Information Technology group
j

Sub:-Microsoft Information Technology group

By:-JIGNESH VAGHASIYA

Paper Presentation

Posted by Hardik Chauhan On July - 23 - 2010

We like to share collection of the Paper Presentation for the Engineering Students to help them to make their Paper Presentations.This Paper Presentation is for the reference for the Students.By Using this Collection you will we able to make your Paper Presentation more effective and Efficient.

Name Size Version Last Modification Date
1.95 MB 8051 13 May 2012
Atm 230.00 kB   13 May 2012
Account Payable System Doc 923.00 kB   13 May 2012
Airborne Internet 225.00 kB   13 May 2012
Amoeba 351.50 kB   13 May 2012
An Intelligent On Line System For Content Based Image Retrieval 302.00 kB   13 May 2012
Application Of Fuggy Logic In Medicine 220.00 kB   13 May 2012
Artificial Intelligence In Chess Designing 123.00 kB   13 May 2012
Artificial Intelligence 1.35 MB   13 May 2012
Artificial Intelligence2 228.00 kB   13 May 2012
Artificial Neural Networks 155.50 kB   13 May 2012
Artificial Neural Networks2 185.00 kB   13 May 2012
Banking Management System 1.53 MB   13 May 2012
Beowulf 298.50 kB   13 May 2012
Bio Infomatics & Biometrics 155.00 kB   13 May 2012
Biochip In Humanbody 38.00 kB   13 May 2012
Bioinformatics 1 133.00 kB   13 May 2012
Bioinformatics 2 78.00 kB   13 May 2012
Bioinformatics 3 747.50 kB   13 May 2012
Bioinformatics 4 52.50 kB   13 May 2012
Bioinformatics 213.00 kB   13 May 2012
Bios 41.50 kB   13 May 2012
Bluetooth Technology 302.00 kB   13 May 2012
Cpu Inheritance Scheduling 136.50 kB   13 May 2012
Cache Affinity Scheduling 1.68 MB   13 May 2012
Compressed Air Car's Technology 825.50 kB   13 May 2012
Computer Viruses And Worms 645.00 kB   13 May 2012
Computer Viruses 122.50 kB   13 May 2012
Cyber Crime 21.00 kB   13 May 2012
Cybernetic Organism Beyond An Individual 37.50 kB   13 May 2012
Cyborg 1 48.00 kB   13 May 2012
Cyborg 2 21.50 kB   13 May 2012
Cyborg Technology 143.50 kB   13 May 2012
Dsl Technology Doc 434.00 kB   13 May 2012
Data Backup And Recovery In Dbms 235.00 kB   13 May 2012
Data Communication Technology 94.50 kB   13 May 2012
Data Compression 104.50 kB   13 May 2012
Data Mining & Data Warehousing Doc 325.50 kB   13 May 2012
Data Mining 2 Doc 69.00 kB   13 May 2012
Data Warehousing 375.00 kB   13 May 2012
Data Warehousing2 109.00 kB   13 May 2012
Digital Communication 293.00 kB   13 May 2012
Digital Manufacturing Doc 127.00 kB   13 May 2012
Digital Signature 175.00 kB   13 May 2012
Distributed Systems 440.50 kB   13 May 2012
Domain Name System 308.50 kB   13 May 2012
Dot Net Technology 1 Doc 71.50 kB   13 May 2012
Dot Net Technology 2 112.50 kB   13 May 2012
Dot Net Technology 64.76 kB   13 May 2012
Electonics Wastages A Poisonous Soup Of 21 Century 224.50 kB   13 May 2012
Electronic Voting System 262.50 kB   13 May 2012
Embedded System 107.50 kB   13 May 2012
Embedded System1 97.50 kB   13 May 2012
Embedded Technology Doc 78.50 kB   13 May 2012
Encrypted File Systems 273.00 kB   13 May 2012
Energy Efficient Electrical Drives 40.00 kB   13 May 2012
Environmental Friendly Refrigeration & Air Conditioning System Doc 76.00 kB   13 May 2012
Face Morphing 536.00 kB   13 May 2012
Face Recognition 1 1.38 MB   13 May 2012
Face Recognition 2 1.43 MB   13 May 2012
Face Recognition 2.67 MB   13 May 2012
Feasibility Of Granite Powder As A Moulding Sand For Aluminium Alloy Casting In Full Moulding 220.00 kB   13 May 2012
Firewall 371.00 kB   13 May 2012
Firewall 362.77 kB   13 May 2012
Firewalls 2 184.00 kB   13 May 2012
Firewalls 155.50 kB   13 May 2012
Fuel Cells On Aerospace 25.00 kB   13 May 2012
Future Electrical Steering System 144.00 kB   13 May 2012
General Packet Radio Services 537.00 kB   13 May 2012
Geographical Database And Global Positioning System 155.00 kB   13 May 2012
Gigabit Networking 169.00 kB   13 May 2012
Global Positioning System 205.50 kB   13 May 2012
Graph Cut Textures 1.26 MB   13 May 2012
Graphics Card 96.50 kB   13 May 2012
Hacking 141.50 kB   13 May 2012
Hacking2 529.50 kB   13 May 2012
Hard Disk 222.50 kB   13 May 2012
Holographic Memory 2 98.50 kB   13 May 2012
Holographic Memory 127.50 kB   13 May 2012
Holographic Memory2 65.50 kB   13 May 2012
Image Commpression For Mobile Multimedia Services 2.59 MB   13 May 2012
Image Morphing 19.00 kB   13 May 2012
Image Processing 1 306.00 kB   13 May 2012
Image Processing 2 183.00 kB   13 May 2012
Image Retrieval Using Segmentation 445.50 kB   13 May 2012
Indian Voting Machines 100.00 kB   13 May 2012
Inferring Body Pose Without Tracking Body Parts 155.00 kB   13 May 2012
Infrared Remote Control Timer 80.67 kB   13 May 2012
Intel Pentium 161.50 kB   13 May 2012
Internet Banking 511.50 kB   13 May 2012
Iris Recognition Technology 74.50 kB   13 May 2012
Kerberos 479.00 kB   13 May 2012
Key User Features Of Gprs 99.00 kB   13 May 2012
Krypton Doc 217.00 kB   13 May 2012
Lasser Printer 437.50 kB   13 May 2012
Mechanical Refrigeration System 146.50 kB   13 May 2012
Microprocessor Doc 204.00 kB   13 May 2012
Mobile Communication 585.50 kB   13 May 2012
Mobile Computing 1 Doc 191.50 kB   13 May 2012
Mobile Computing 2 437.50 kB   13 May 2012
Mobile Networks Doc 214.50 kB   13 May 2012
Mobile Phone Technology 456.50 kB   13 May 2012
Mobile Technology 266.50 kB   13 May 2012
Mobile Viruses 96.00 kB   13 May 2012
Modem 49.50 kB   13 May 2012
Multimedia Database Management System 336.50 kB   13 May 2012
Multimedia Messaging Service 265.00 kB   13 May 2012
Nano Medicine 109.50 kB   13 May 2012
Nano Technology 1 79.50 kB   13 May 2012
Nano Technology 2 136.50 kB   13 May 2012
Nano Technology 3 1.23 MB   13 May 2012
Nanotechnology Binding Experiment With Biosensor Doc 286.00 kB   13 May 2012
Neno Technology 4 Doc 95.50 kB   13 May 2012
Network Ram Disk 167.50 kB   13 May 2012
Network Security & Cryptography 2 98.00 kB   13 May 2012
Network Security And Cryptography 1 199.50 kB   13 May 2012
Network Security & Cryptography 727.00 kB   13 May 2012
Networking Hardware 103.00 kB   13 May 2012
Neural Network 103.00 kB   13 May 2012
Ofdm For Mobile Communication 174.50 kB   13 May 2012
Olap An Introduction 775.50 kB   13 May 2012
Oled 1.30 MB   13 May 2012
Optical Soliton Pulses For Ultra Fast Optics 231.00 kB   13 May 2012
P2p Architectur 363.50 kB   13 May 2012
Pentium4 Processor 500.00 kB   13 May 2012
Power Hump Doc 96.00 kB   13 May 2012
Proxy Server 1.06 MB   13 May 2012
Quantum Computer 332.00 kB   13 May 2012
Quantum Computers 129.50 kB   13 May 2012
Ram 297.00 kB   13 May 2012
Radio Frequency Identification 102.50 kB   13 May 2012
Real Time Task Scheduling 222.50 kB   13 May 2012
Remote Control Fore Home Appliances 115.47 kB   13 May 2012
Restaurant Billing System 426.50 kB   13 May 2012
Robotics 1.67 MB   13 May 2012
Sip Session Initiation Protocol 133.50 kB   13 May 2012
Smart Scheduling 119.50 kB   13 May 2012
Sms Doc 560.00 kB   13 May 2012
Secret Sharing Cryptography 381.50 kB   13 May 2012
Secure Communication Protocol 89.50 kB   13 May 2012
Session Initiation Protocol 133.50 kB   13 May 2012
Simple Digital Security System 126.22 kB   13 May 2012
Simple Network Management Protocol Architecture 326.00 kB   13 May 2012
Smart Card 253.00 kB   13 May 2012
Smart Dust 456.00 kB   13 May 2012
Solar Power Energy 332.50 kB   13 May 2012
Sound Card 506.00 kB   13 May 2012
Strain Gauge Doc 73.00 kB   13 May 2012
Switched Reluctance Drives 147.00 kB   13 May 2012
System On Chip Design 147.50 kB   13 May 2012
Tcp Port Scanners 111.00 kB   13 May 2012
Telecommunication 1.48 MB   13 May 2012
Telecommunication2 469.00 kB   13 May 2012
The Challenge Of Intelligent Systems 108.50 kB   13 May 2012
The Design Of Cellular Manufacturing Systems And Whole Business Simulation 120.50 kB   13 May 2012
The Socket Interface 86.00 kB   13 May 2012
Touch Screen 355.00 kB   13 May 2012
Transaction Consistency In Mobile Distributed Real Time Database System 131.50 kB   13 May 2012
Transaction 713.50 kB   13 May 2012
Uml 146.00 kB   13 May 2012
Unix File System 212.50 kB   13 May 2012
Voip Doc 113.50 kB   13 May 2012
Vetiver Glass 664.00 kB   13 May 2012
Virus ! 1.46 MB   13 May 2012
Wap 56.00 kB   13 May 2012
Web Page Designing 169.50 kB   13 May 2012
Web Services 121.50 kB   13 May 2012
Wi Fi 95.00 kB   13 May 2012
Wi Fi2 419.00 kB   13 May 2012
Wireless Internet Technology 226.00 kB   13 May 2012
Wireless Local Loop 140.00 kB   13 May 2012
Wireless Technology 119.00 kB   13 May 2012
World Class Manufacturing 64.50 kB   13 May 2012
World Wide Web 740.00 kB   13 May 2012
Zero Emission Vehicle 153.00 kB   13 May 2012
Cell Processor 1.45 MB   13 May 2012
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Posted by Vasanth Kamal On July - 22 - 2010

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